M07300 - SEMI M73 - Test Method for Extracting Relevant Characteristics from Measured Wafer Edge Profiles StdTpc-Automated Material Handling Systems support equipment

support equipment

SEMI C61-0707 (Withdrawn 0114)

the locations of the reference points that separate the various segments of the edge profile are determined

SEMI M31-0306 (technical revision)

M07300 - SEMI M73 - Test Method for Extracting Relevant Characteristics from Measured Wafer Edge Profiles StdTpc-Automated Material Handling Systems support equipment1 Purpose 1. 1 SEMI M1 specifies the contour of the shaped edge of silicon wafers by using templates that allow a wide variation in wafer edge profiles manufactured by silicon suppliers to still meet the specification. 1. 2 In many advanced wafer applications, a much tighter specification of the edge profile is required to control variations in subsequent circuit processing. These specifications frequently include values for certain characteristics